▼Application range:

▼LED chip, LED internal bonding line, LED crystal line, CSP, flip chip, COB, QFN, QFP, etc.

▼ IC package, rectifier bridge, resistor, capacitor and other connectors, etc., system LSI and other ultra-fine parts (disconnection, continuous welding)

▼ Product Features:

▼Configure a maintenance-free sealed tube type microfocus X-ray tube with long service life and low maintenance cost

▼ high resolution ability, the smallest detectable 2um defect

▼Measurement of size: It is possible to measure the distance of 2 points, the angle between the line and the line, and the measurement of the arc is automatically calculated.

▼LED package bubble rate measurement: After the limit value is set, according to the automatic calculation, the qualified and unqualified products can be identified.

▼Detector rotation detection, instant defects that are not easily found from the vertical direction, can also be detected by oblique fluoroscopy

▼Customized products according to customer's requirements and standards